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TCAN844-Q1: Co-layout for SOT-23, SOIC and VSON

Taku Murayama
Intellectual 1830 points
Part Number: TCAN844-Q1

Tool/software:

Hi,

Do you have any proposed layout which can be mounted all SOT-23, SOIC and VSON package?

BR,

Taku

  • 0
    TI__Guru 50616 points

    Hi Taku,

    Unfortunately, we do not have a specific proposal.

    However, you may design PCB footprint with short / direct traces and the pads for different packages arranged to allow soldering of one package at a time.

    You may also consider:

    • SOIC with the wider pin spacing as the main  footprint. Aligning SOIC pins with the output pads of the universal footprint.
    • Using shared landing pads for all packages. SOT-23 with the small footprint and narrower traces. Placing pads to overlap with SOIC pads for compatibility.
    • Then thermal pad for VSON (should not interfered with SOT / SOIC soldering). Use a large center pad with multiple thermal vias and ensure solder mask openings match the exposed pad while also using silkscreens to mark positions for each package, thanks.

    Best Regards,

    Michael.