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DS90UB962-Q1: Via on thermal pad

Part Number: DS90UB962-Q1


Tool/software:

Hello Expert,

Could you please answer following questions?

  1. Could they change via diameter on thermal pad from recommended 0.2mm to 0.6mm?
    1. I believe this via hold diameter have impact only for thermal performance but I'd like to make sure it just in case.
  2. Could we eliminate via from thermal pad as long as we can satisfy thermal dissipation performance?


Best regards,
Kazuki Kuramochi