Tool/software:
Hello Expert,
Could you please answer following questions?
- Could they change via diameter on thermal pad from recommended 0.2mm to 0.6mm?
- I believe this via hold diameter have impact only for thermal performance but I'd like to make sure it just in case.
- Could we eliminate via from thermal pad as long as we can satisfy thermal dissipation performance?
Best regards,
Kazuki Kuramochi
