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AM26LS31: Process Change due to Additional Fab site.

Kengo.Y
Guru 11175 points
Part Number: AM26LS31

Tool/software:

Hi team,

I have some questions on process change by PCN(20240328001.1).

1) Is there any change in the schematic in the datasheet p.1? Because the process has changed from bipolar to BiCMOS.

2) If yes, can I ask more detail about the schematic?  I'd like to know what different between before and after.

3) I believe the BiCMOS process is sensitive to external noise. Is there any way to prevent latch-up?

BR,
Kengo.

  • +1
    TI__Guru 72341 points
    Kengo.Y said:
    1) Is there any change in the schematic in the datasheet p.1? Because the process has changed from bipolar to BiCMOS.

    We don't really provide internal schematics of our devices anymore. 

    Kengo.Y said:
    2) If yes, can I ask more detail about the schematic?  I'd like to know what different between before and after.

    I'm unable to provide detailed schematics of our devices as this is considered confidential.

    Kengo.Y said:
    3) I believe the BiCMOS process is sensitive to external noise. Is there any way to prevent latch-up?

    Our devices go through a latch up qualification process. Is there a specific condition you are thinking of for when latch-up occurs? 

    -Bobby

  • +1
    Guru 316470 points

    The new device uses a completely different die, with the logic almost or completely CMOS. The guaranteed limits stay the same, but all typical values are likely to have changed.

    Latch-up will not happen as long as you stay inside the absolute maximum ratings.