SN65LBC176: Why the internal pins structure of the NG IC mentioned by customer is different from other silk screened IC ?

PCN# 20221031004.1A introduced new fab and assembly sites.

The new chips use an entirely new die. The guaranteed datasheet parameters have not changed, but typical parameters might have. It is likely that your circuit relies on those characteristics; please show the schematic.

Hi Gabriel,

As Clemens pointed out, the two ICs are different dies (You can see a size difference in the xray). The newer one is smaller because we used a newer process technology.

Gabriel Wang1 said:

Also, we have noticed serigraphy differences between chip that shows failure and chip that work OK.

Are you performing an ICT and it's failing or it actually has functional fails?

Any more detail you can provide?

-Bobby

Dear Sir

Could u hlep answer below customer question?

1. Why the marking on IC body looks so different (We didn't get confirmation from TI)
   2. Why internal bonding wire structure of IC is different
    TI mention that a PCN was released, but we didn't find the P/N from The said PCN:

Gabriel Wang1 said:

Why the marking on IC body looks so different (We didn't get confirmation from TI)

You may need to reach out to the PCN team: PCN_ww_admin_team@list.ti.com to see if the top marking PCN was sent out for your specific device. (looks like there may have been a font change with the newer one).

Gabriel Wang1 said:

2. Why internal bonding wire structure of IC is different
 TI mention that a PCN was released, but we didn't find the P/N from The said PCN:

As Clemens pointed out, the PCN for the Q has the wire change mentioned (From Au to Cu).