Tool/software:
hello expert:
is there any risk to use 1 connector at 983 serializer side to separate to two connectors to transfer FPD-link iii with stp cable?
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Tool/software:
hello expert:
is there any risk to use 1 connector at 983 serializer side to separate to two connectors to transfer FPD-link iii with stp cable?
Hello,
This type of topology does not pose a risk as long as the channel between each display meets the channel specification. Using one connector at the separate and two separate displays is a common topology for FPD-Link.
Best,
Jack
hello Jack:
thank for your reply .
1.what is your mentioned channel specification ?
2.from my understanding , this topology will not benefit to EMC performance ,like RE CE and BCI ;
i think it will broke the stp shield layer ,i am not sure how to handle the shield layer ?
1.what is your mentioned channel specification ?
The channel specification can only be distributed through secure channels. Please reach out to your local TI representative or FAE for access to this document.
2.from my understanding , this topology will not benefit to EMC performance ,like RE CE and BCI ;
i think it will broke the stp shield layer ,i am not sure how to handle the shield layer ?
I misunderstood your first question. I do not recommend modifying a cable harness or cable because it will not longer match the cable vendors validation.
For your topology, the solution would be to use a cable assembly that has a "y-split". This allows for only one connector on the SER board. See below photo from Rosenberger HMTD showing different connector combinations. I specifically highlighted the dual to single assembly as this is relevant here.
Note that I am not recommending HTMD as the only solution. Other cable/connector vendors may offer assemblies that can suite your requirements.
Best,
Jack
hello Jack:
i can understand there is no problem with the HMTD connector which is just combine two connectors; our use case is use below connector(4-pin shield) at SER board side ,split two connectors to different display DES board. do you think what is potential risk with this use case ?
Thank you for clarifying. I cannot recommend such an approach given that this would be a rather improvised approach to achieve a y-split. Earlier you mentioned that the STP shield would be broken in such an approach. Our channel specification does require a certain level of shielding effectiveness for both STP and Coax signaling. Potential risk of modifying the cable geometry and/or shield would be: worse EMC performance, worse noise rejection.