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DS250DF230: Thermal Information

Qiang Ren
Intellectual 2065 points
Part Number: DS250DF230
Other Parts Discussed in Thread: DS280DF810, ,

Tool/software:

Team,

When we doing the thermal design, we are using the below D/S table for reference. As you can see the Rj information are based on 4-layer PCB system. we are doing the 12 layer PCB and do we have the Rj data for the 12 layer PCB especially for the junction-board data? Or how much difference will be there between 12 layer and 4 layer data? Thanks!

Best,

Qiang

  • 0
    TI__Mastermind 36533 points

    Hi Qiang,

    I will look to see if we have information on this.  In general, we expect the thermal resistance to be lower.  For example, from DS280DF810 data sheet:

    Is the customer trying to determine if heatsinking is necessary?

    Also, if this pertains to a project, can you share project information?  You can send over private message to keep it off the public forum.

    Thanks,

    Drew

  • 0 in reply to Drew Miller1
    TI__Intellectual 2065 points

    Drew,

    Yes we doing the thermal design to determine if heat sink needed or if need to improve the thermal design. 

    For the project information, I will share by email.

    Thanks.

    Qiang

  • 0 in reply to Qiang Ren
    TI__Mastermind 36533 points

    Hi Qiang,

    Thanks for sharing the project information.

    I am discussing 12L PCB thermal parameters with some thermal experts.  I will get back to you early next week with additional details.

    Thanks,

    Drew

  • 0 in reply to Drew Miller1
    TI__Mastermind 36533 points

    Hi Qiang,

    Based on discussions with thermal experts, the key difference in the case of DS280DF810 is the board area (instead of PCB layers).  JEDEC board copper area is 3x3", but top layers only extend 1" on the side of the package.  The 10 layer board is 6x8", so much larger area.  Because of this, we believe that total PCB area will have a larger impact than number of layers when it comes to reducing junction-to-board characterization parameter.

    As it pertains to DS250DF230, depending on the ambient temperature in the customer's system, it may be worth considering heat sinking.  Internal simulation previously done with our DS250DF230EVM (which is also a 12 layer PCB) showed Rth-JA was ~40C/W.

    Using thermal resistance and maximum power dissipation, the junction temperature may exceed recommended Tj_max (assuming ambient temperature of 85C).

    TJ = TA + Rth-JA × PT

    TJ = 85 + (40 * (0.445*2 + 0.165) ) = 127C

    https://www.ti.com/lit/an/slua844b/slua844b.pdf

    Thanks,

    Drew