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DP83867IR: Inquiry Regarding Solder Volume for DP83867IR_1G Ethernet Transceiver

JAEMOON GOO
Prodigy 35 points
Part Number: DP83867IR

Tool/software:

Dear TI Representative

We have examined the DP83867IR_1G Ethernet transceiver mounted on our produced boards using X-RAY, and we observed a phenomenon that appears to be insufficient solder.

Comparing the metal mask stencil area manufactured by our SMT supplier with the TI Data Sheet, we found that the solder volume is approximately 45% of the Data Sheet specification.

Therefore, we would like to ask the following questions:


1. Do you assess that a solder volume of 45% compared to the Data Sheet specification is acceptable and does not cause any issues?

2. Up to what percentage of solder volume compared to the Data Sheet specification can be considered acceptable without causing problems?

3. Does a solder volume of 45% compared to the Data Sheet specification result in performance degradation due to heat generated by the component?

Thank you

  • 0
    TI__Mastermind 30090 points

    Hi Jaemoon,

    1. Solder volume of 45% can cause issues with heat transfer. I strongly recommend increasing the solder volume to align with the datasheet layout stencil.

    2. We can only guarantee the DP83867 reliability with the full solder volume described in the datasheet.

    3. Yes that is one concern. We need a solid connection between the device thermal pad and the board to regulate heat transfer out of the device. Additionally, the solder helps to keep the device mechanically connected to the board.

    Best,

    Shane