Tool/software:
这颗料有几家晶圆和封装厂在供,这两个x-ray比对不一致,是否都存在,...
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Hi molly molly,
I'm not able to translate the message you sent me properly but based off the picture I think I can guess what you are asking.
The device on the left is likely the old design with the older die and the picture on the right is the new die (I can tell based on the size of the die). We did this change because we are shutting down fabs that use older process technologies and replacing the devices with new dies using modern day processes in 300mm wafers.
PCN20210811000.1A SN65HVD3082E.pdf
-Bobby