AM26LV31: Die Shrink

Kazuki Itoh

Part Number: AM26LV31

Tool/software:

Hi team,

My customer is investigating AM26LV31INSR as alternative of AM26LV31CNSR for PCN.
AM26LV31INSR has better operating temperature range but the thermal resistance is getting worse.
Does this mean AM26LV31INSR experienced die shrink PCN in the past?

Best regards,
Kazuki Itoh

3 months ago

0 Clemens Ladisch 3 months ago

Guru 316690 points

The PCN for the AM26LV31INSR is 20240429005.1.

0 Kazuki Itoh 3 months ago in reply to Clemens Ladisch

TI__Genius 10730 points

Hi Clemens,

Thank you for sharing the PCN link.

However, it doesn't explicitly show if the die size is shrunk.

BU team, could you please check?

Best regards,

Kazuki Itoh

+1 Clemens Ladisch 3 months ago in reply to Kazuki Itoh

Guru 316690 points

The new 300 mm wafers do use smaller dies.

+1 BOBBY 3 months ago in reply to Kazuki Itoh

TI__Guru 72751 points

Kazuki,

The newer die is in the 300mm wafer process technology as Clemens pointed out. A smaller die will result in worse performance when thermals are considered. One thing to note though, the old design of this device used BJTs which resulted in much larger current consumption. The newer die uses CMOS technology which will result in a lower supply current during idle or disabled driver conditions. So this may offset some of the thermal build up.

-Bobby

Interface

Interface forum

AM26LV31: Die Shrink