Tool/software:
hi team,
We need your help to know few details related to MPN: TPD1E01B04DPYR & SN74AXC4T774QPWRQ1 by Texas Instruments
- Copper Bond wire used as Die to package or substrate wire bond material, is it qualified by AEC-Q006 ?
- Country of Origin/ Manufacturing Site for the respective MPNs?
- for MPN: TPD1E01B04DPYR , what is the Maximum Junction temperature?
Thanks
Vivek