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SN74AXC4T774-Q1: SN74AXC4T774QPWRQ1- COO & AEC-Q006 qualification check for Cu bond wire

Part Number: SN74AXC4T774-Q1

Tool/software:

Hi Team,

We need your help to know few details related to SN74AXC4T774QPWRQ1 by Texas Instruments

  1. Copper Bond wire used as Die to package or substrate wire bond material, is it qualified by AEC-Q006 ?
  2. Country of Origin/ Manufacturing Site for the respective MPNs?