DP83822I: Soldering Issue with QFN Package

Ewelina Mucha

Part Number: DP83822I

Tool/software:

Dear TI Team,

we use your part DP83822IRHBR (our part number A5Q20006571) and have an issue with the QFN package ( we need to optimize the soldering),

Our questions:

1. Are the pinends fully solderable? (According to the IPC, this may not always be the case)

2. Is the fully solderability only possible on the underside of the pinends?

We could not find the answer to these questions in your data sheet, so we would like to ask you to clarify the issue and send us your statement (preferably with data sheets/documents where we could find this information).

WE would be glad to get a short-time feedback from you.

Thank you in advance

Best wishes,

Ewelina Mucha

8 months ago

0 J 8 months ago

TI__Mastermind 26791 points

Hi,

Please refer to page 132 of the datasheet. It shows the full solder mask layout for DP83822.

Best,
J

0 Ewelina Mucha 8 months ago in reply to J

Prodigy 20 points

HI J,

the layout is not the issue, we need the infomration it the pins of the part need to be fully soldered ( the whole pin on the side of the part) .

In the IPC A 610 under Point 8.3.13 the issue is described (there are some parts with pins configurations that have no exposed pins and no continuous solderable surface of the pins is needed) .

How is your part specified? (need the pin be fully soldered, the whole pin on the side of the part or not?).

Can you please send us any datasheet specification for this issue?

Thanks,

Ewelina

0 J 8 months ago in reply to Ewelina Mucha

TI__Mastermind 26791 points

Hi,
Please follow this app note:
https://www.ti.com/lit/an/slua271c/slua271c.pdf?ts=1753812948735

Best,
J

Interface

Interface forum

DP83822I: Soldering Issue with QFN Package