PCA9306: PCN Number: 20231127002.1 / Qualification of HFTF as an alternate Assembly site for select devices

Tool/software:

Hi TI team, 

1. Please clarify what the highlighted abbreviations on the change mean or explain what it is:
   1. HFTF
   2. NiPdAu
   3. G4 = NiPdAu
   4. R-30
   5. A-18
   6. G3 = Matte Sn
2. What are the differences between the current and the additional Lead finish, Mold and Mount compound. Are they equivalent? How are you qualifying the change?
3. Are the changes in labeling only to differentiate the lead finish? G3 and G4? Or what else is changing, based on the circled info in the attachment 1 
4. Can you explain how this change is impacting the process or if it not impacting explain why?