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SN74LVC2T45: SN74LVC2T45DCTR and SN74LVC2T45DCTRE4: Plating Heated after Deposition | Tin thickness (microns) | Process

Part Number: SN74LVC2T45

Tool/software:

Components: SN74LVC2T45DCTR and SN74LVC2T45DCTRE4 

Part Number

Item 2

Components: SN74LVC2T45DCTR and SN74LVC2T45DCTRE4

Note: (identicial besides the PN)

 

Plating Heated after Deposition

Tin thickness (microns)

Process

 

A) No

A) <1.25

A) Electroplate

 

B) Annealed

B) 1.25-6.5

B) Immersion

 

C) Fused

C) 6.5-13

C) Hot Dip

 

 

D) 13-25

 

 

 

E) >25