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TCAN1057A-Q1: Confirmation of adverse avoidance situations

ian wu
Intellectual 795 points
Part Number: TCAN1057A-Q1


Tool/software:

hi Expert

A question was raised regarding the confirmation of past poor evasion situations of the Can chip TCAN1057AVDRQ1:

Has this chip ever experienced problems such as insufficient contact area due to bonding wire defects, poor contact under temperature changes, and subsequent communication failures? If it has happened, how did the original factory improve it? If it had never happened, how would it have been controlled during the production process?

  • 0
    TI__Guru 52816 points

    Hi Ian,

    This seems to be more of a quality concern and less of an application concern. However, based on my experience with supporting this device - I do not see where we experienced such issues. If it happens, the assembly site typically accepts the customer returned unit, investigates and then implement the appropriate corrective action to help ensure assembled units do not experience such concerns, thanks.

    Best Regards,

    Michael.