Part Number: TUSB8020B
Tool/software:
Hello, Texas Support Team,
Currently, we have a situation with this component: TUSB8020BIPHPR. SMT line reported me voids issues after reflow process. Please find enclosed image about it. Additionally, we have done solderability test and the component has a strange behavior, please see image as well. After that, we baked them for deleting any humidity, however, the results were not positive.
The date code is: 2331 and lot code: 3455636PHI
The idea is to understand, what happens here. I appreciate any feedback and support.
If you have additional questions, please let me know. Voids issue on the thermal pad.pdf
Thanks,
