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TLK2501: Rare, Intermittent Data Corruption

Part Number: TLK2501


Tool/software:

Hello TI Rep,

We’re observing rare, localized data corruption across multiple systems that use the TLK2501 as the high-speed transmit serializer. In a representative run at room temperature, we captured 10 bad frames out of ~4,400 total. Each event is confined to a single horizontal row within the frame, with bit-level anomalies such as words forced to 0x0000 or apparent MSB flips, while adjacent rows remain clean. After replacing the TLK2501 on one affected board, the corruption ceased, and subsequent captures produced no bad frames. Our schematic and layout have been reviewed against TLK2501 documentation and appear compliant.  We’re seeking guidance on potential device sensitivities or operating conditions that could explain these intermittent word/bit errors.

 

Setup (summary)

  • TX only (RX unused). AC-coupled CML outputs into 50 Ω.
  • VDD = 2.5 V; 49.9 Ω pull-ups to 2.5 V on DOUTTXP/N; RREF = 150 Ω; local decoupling + ferrite bead per datasheet.
  • GTX_CLK provided from FPGA; TLK2501 control/test pins in normal (non-test) mode.
  • Payload is a deterministic 14-bit test pattern (frame timing identical to operational mode) used to detect single-bit/word errors.

 

Test Method

  • Frames were captured continuously and compared against a known-good reference on a pixel/bit basis to detect single-bit or word errors.

 

Observed Behavior

  • Room temperature run: 10 bad frames out of ~4,400 total
  • (frames 4280, 4307, 4327, 4335, 4346, 4366, 4377, 4380, 4382, 4389).

 

Error Characteristics:

  • Corruption is row-localized: each event affects one horizontal row; adjacent rows are clean.
  • Bit-level deltas show:
    • entire words forced to 0x0000, or
    • MSB group toggling (upper bits flip), or
    • specific repeated word values.
  • No pixel location repeats across events (intermittent, not stuck).
  • Additional analysis across the 10 frames shows dropped bits, repeated data patterns, and specific erroneous pixel values consistent with the above behaviors.

 

What we’ve tried / observed

  • Replacing TLK2501 on an affected board removed the failures (no bad frames observed afterward).
  • We reviewed our schematic/layout against TLK2501 + PowerPAD app notes; no non-compliance found (details available).

 

Request for guidance

  • Are there known TLK2501 sensitivities that could produce intermittent word-level clears (0x0000) or MSB flips under otherwise nominal conditions?
    • e.g., RREF tolerance/drift, VDD ripple, CML load/termination tolerance, GTX_CLK jitter, device aging/ESD/latent damage, PowerPAD solder voiding/thermal excursions.
  • Are there errata or field notes related to mid-packet disturbances (e.g., IDLE insertion, TX_EN/TX_ER timing) that might map to our symptoms?
  • Recommended bench diagnostics to isolate the device vs. system:
    • eye diagram at DOUTTX±, supply ripple at the TLK2501 pins, jitter mask at GTX_CLK, PRBS mode BER targets, temperature sweep guidance.
  • Any minimum/typical BER expectations for TLK2501 in AC-coupled 50 Ω links and recommended PRBS pattern/length?

 

We can share scope captures (TX eye, VDD, GTX_CLK), layout excerpts (PowerPAD, RREF placement), and error logs upon request.

 

Thanks for any pointers or known pitfalls to investigate.

  • Hi Matt,

    Thanks for reaching out! The expert for this device is currently out of office, so there may be a delay in response until the end of this week. I'll try to assist in the meantime

    Replacing TLK2501 on an affected board removed the failures (no bad frames observed afterward).

    1. Have you noticed this issue on multiple boards or just one board? If the issue can be isolated to one board and replacing the TLK2501 fixes the problem, this could be related to a device-specific or solder issue with the failing part. If there is only one failing board + device combo, a full A-B-A swap can narrow down whether this is a solder issue or the device itself is the cause.

    2. Were there any adverse factors in the failing test that might have disrupted your signal? I see that all 10 error frames are near the last 100 frames sent out of 4400, so am curious if there was an event in the test chamber that may have interfered. Was there only one failing test run or were there multiple done?

    Best,

    Shane

  • Hi Shane,

    Thanks for the reply.

    We have observed the bad frames on 2 CCAs.  We have more systems that reported the same failure mode and are candidates to repeat our test.  We inspected the solder on the 2 CCAs and x-rayed the 2nd.  We did not find nonconformances with the solder.  We did keep the TLK2501 from the 2nd CCA and can install it on another CCA to confirm if the issue follows the device.

    There were no known adverse effects during the time of the bad frames.  Conditions were the same.  The testing was at room ambient temperature and not in a chamber.  We had 5 runs with bad frames for the 1st CCA.  We have had 2 runs with bad frames for the 2nd CCA.

    Best Regards,

    Matt