Hello there,
The ESD501 recommended footprint has 0.3 x 0.5 mm pads separated by 0.7 mm center-to-center. This makes the pad-to-pad spacing 0.4mm.
For intrinsic safety, I need 0.5mm pad-to-pad spacing. I would like to modify the recommended footprint to 0.25 x 0.6 mm pads separated by 0.75 mm center to center.
Would this still be acceptable for reflow assembly?
Joseph
