Part Number: TCAN1043A-Q1
Hi TI,
I am designing a CAN-FD differential pair on a multilayer PCB, and I have a question regarding the recommended spacing of ground stitching vias along the CAN-FD traces.
Currently, I placed stitching vias very densely (about 0.5 mm spacing) on both sides of the CAN-FD differential pair. However, since CAN-FD operates at relatively low frequencies (up to around 5–8 Mbps), I am not sure whether such a dense via fence is necessary or if it could introduce unnecessary parasitic effects.
Could you advise on the appropriate ground stitching via spacing (or whether a via fence is even needed) for CAN-FD traces?
I would like to understand TI’s recommendation for:
Q) the recommended via-to-via spacing ? (below Capture's Sv data)

Thank you for your guidance.
Best regards,