AM26LV32E: AM26LV32E AND AM26LV31E Mounting process

Jonas Puchert

Prodigy 155 points

Part Number: AM26LV32E

Hi Team,

Could you please answer the following questions:

Reflow profile T.max
Maximum temperature that the component can withstand
Temperature for rework or manual soldering
Temperature for selective wave soldering (SWS)
MSL (Moisture Sensitivity Level) category or level
Assembly restrictions or recommendations
Restrictions due to immersion in liquids

thank you very much for your support & best regards,

Jonas

7 months ago

0 Ethan Sempsrott 7 months ago

TI__Mastermind 27342 points

Hi Jonas,

This information can be found in the quality reports for both devices. Please enter the exact OPN here: https://www.ti.com/quality-reliability-packaging-download/

Our devices are generally MSL Level-1-260C-UNLIM. This means it has a reflow max of 260C.

You can refer to this app note on MSL ratings: https://www.ti.com/lit/an/spraby1a/spraby1a.pdf

As for liquid immersion, we do not have an official recommendation for this. I would reach out to our packaging team on this for further comment.

Best,

Ethan

0 Jonas Puchert 6 months ago in reply to Ethan Sempsrott

TI__Prodigy 155 points

Hi Ethan,

If I understand correctly, the temperature for max. rework/manual soldering used to be different from the maximum temperature during oven processing.

Could you confirm if they are the same temperature (Tp in the graph of the app note) or it is a different data?

thanks and regards,

Jonas

0 Ethan Sempsrott 6 months ago in reply to Jonas Puchert

TI__Mastermind 27342 points

Hi Jonas,

These are separate temp values. The peak reflow rating of 260C is lower than typical soldering irons for manual rework. To my knowledge, we do not provide a rework max temp. This might be a question for our packaging team rather our specific Transceiver Team.

You could also reach out to the author of that app note (Allan Webber) as well.

Best,

Ethan

Interface

Interface forum

AM26LV32E: AM26LV32E AND AM26LV31E Mounting process