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DP83826E: Clarification regarding DP83826ERHBR hardware configuration

Part Number: DP83826E

Hi team,

I see several discrepancies between the DP83826ERHBR datasheet and SNLA344A:

  • Center-tap decoupling (primary side): Datasheet 2 nF vs. app note 0.1 µF ∥ 1 µF.
  • PHY–magnetics pins (TD_P, TD_M, RD_P, RD_M): App note adds 4.7 µF to GND on each line. Not present in datasheet.
  • CEXT (PHY external cap): Datasheet 2 nF vs. app note 2.2 µF ∥ 0.1 µF.

Could you please advise:

  1. Which values are recommended for a standard 10/100BASE‑TX design?
  2. Rationale for the larger µF capacitors (EMI/EMC, ESD/EFT robustness, magnetics choice, layout)?
  3. Impact on performance if we adopt the larger caps (radiated/common‑mode noise, link timing/settling, SI/return loss)?
  4. Any updated collateral/errata that supersedes either document?

Context: DP83826ERHBR, CAT‑5e, center‑tap to 3.3 V via choke, 4‑layer PCB. We can share the magnetics P/N and schematic if helpful.

  • Hi,

    Please follow the configuration in the datasheet. The datasheet presents the most optimal configuration for the product based on continued feedback from customers and validation.

    Best,

    J