Part Number: DS320-SLIMSAS-EVM
We are looking for some technical assistance with a Texas Instruments part that we are having difficulty soldering to boards.
Could you please assist or forward to the appropriate person:
The part number is DS320PR1601ZDGR and it has a NFBGA354 package.
We are using a standard SAC305 type 4 lead-free solder paste and reflowing the boards with a peak temperature of 255C.
All other BGA devices on the board are reflowing perfectly however the DS320PR1601ZDGR devices are not.
We have tried increasing the soak time and ran various trials, however we cannot get the balls on these devices to drop.
Are you aware of any other assemblers having a similar issue?
Does this part have any specific reflow recommendations?
Do you have any suggestions on what we can try?
