• State TI Thinks Resolved
  • Locked Locked
  • Replies 3 replies
  • Answers 1 answer
  • Subscribers 34 subscribers
  • Views 193 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

ESD1LIN24: Request for Confirmation on Construction Variations Observed Under X-Ray Inspection

Ehab Ali
Prodigy 50 points

Part Number: ESD1LIN24

Hello Team,

We hope this email finds you well.

Following an X-ray inspection of part number ESD1LIN24DYFR, we observed the presence of two internal construction variants within the same production population.

All inspected units are mounted in the same orientation on the PCB, with no observable differences in external appearance, solderability, or assembly behavior.

The variation is strictly limited to the internal die and/or bond wire orientation, as visible under X-ray inspection.

As per the datasheet, ESD1LIN24DYFR is specified as a bidirectional ESD protection device with no defined polarity.

In light of this, and given that we do not have in-house facilities to further assess internal design intent, we kindly request your confirmation on the following points:

  • Whether multiple internal constructions (such as die mirroring or lead frame orientation differences) are permitted under the same part number.
  • Confirmation that these internal variations have no impact on form, fit, or function, nor on the electrical performance or reliability of the device.
  • A brief statement confirming that such internal construction differences are normal, controlled, and acceptable within the manufacturer’s design and assembly processes.

For your reference, the X-ray image:

TI.jpg

We appreciate your support and look forward to your clarification.

Thanks in advance.

  • 0
    TI__Genius 12350 points

    Hi Ehab, 

    I am confused on the problem here. Is it because the two devices on the left have a flipped orientation compared to the others?

    Best,

    McKenzie

  • 0 in reply to McKenzie Eaker
    Prodigy 50 points

    Hello McKenzie,

    Thank you for your message and for taking the time to review the information shared.

    To clarify, our inquiry specifically relates to the two devices highlighted in this X-ray image:



    located at the top left. These two units exhibit a flipped internal orientation when compared to the remaining devices within the same inspected population.

    For alignment, our focus is on the following points:

    • Confirmation that this flipped internal orientation is an acceptable and intentional internal construction variant for part number ESD1LIN24DYFR

    • Confirmation that such internal orientation differences have no impact on form, fit, or function

    • Confirmation that electrical performance and long-term reliability remain unaffected

    We appreciate your support in confirming whether this internal variation is normal and controlled within the manufacturing process.

    Thank you in advance for your clarification.

  • 0 in reply to Ehab Ali
    TI__Genius 12350 points

    Hi Ehab, 

    Looking at the image, the device should follow the below image. If looking at the top left device, pin1 is on the left and pin 2 is on the right. 

    There should also be a dot or indentation in the bottom left corner on the top of the package to denote pin 1. 

    With this information, do all the devices have pin 1 as the smaller leadframe and pin 2 as the larger leadframe? I am trying to understand if there was an issue with a flip orientation in manufacturing. 

    Either way, since this is a bidirectional device, there should be no issues with performance and reliability. Also, no issues with the function of the device. 

    Best,

    McKenzie