TSB41AB3: Solder coverage

Christine Tra

Part Number: TSB41AB3

What is the recommended wettable solder coverage under the thermal pad for QFP part number TSB41BA3FTPFPEP based on X-Ray inspection?

2 months ago

0 Michael Ikwuyum 2 months ago

TI__Guru 68937 points

Hi Christine,

Today is a holiday. Please give some time for some feedback, thanks.

Best Regards,

Michael.

0 Parker Dodson 2 months ago

TI__Guru 54042 points

Hi Christine,

We don't have any special guidance for this part - so our general advice found here: https://www.ti.com/lit/an/snoa040b/snoa040b.pdf would probably be the best guidance we have on this device.

In general for thermal pads the rule of thumb is 50% to 80% coverage to avoid voiding.

Best,

Parker Dodson

Interface

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TSB41AB3: Solder coverage