AM26C32: Maximum Junction Temperature

Thank you for that.  Is there a junction-to-case thermal resistance available for the TSSOP package version of this part (AM26C32IPWR) or a way to determine it?  

Hi Alex,

I believe that is in the datasheet in table 5.4 

Is that not what you are looking for?

-Bobby

Table 5.4 gives junction-to-case (top) thermal resistance; I'm looking for the standard junction-to-case thermal resistance referenced to the bottom of the TSSOP package or a method to calculate it.

Hi Alex,

Thanks for clarifying.

From what I see, this package looks like it does not have a exposed pad at the bottom. TI typically will provide a junction to case bottom when there is an exposed pad for additional thermal dissipation but may not choose to do so if the package doesn't have one....

I think you can use Psi_JB to calculate it. 

https://www.ti.com/lit/an/slrr012/slrr012.pdf?ts=1771628358441&ref_url=https%253A%252F%252Fwww.google.com%252F

Tj-(PowerxPsi)=T_board

-Bobby