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TCAN1473A-Q1: TCAN1473A‑Q1: Is the Thermal Pad (Exposed Pad) Electrically Connected to GND Internally?

Part Number: TCAN1473A-Q1

I am using the TCAN1473A‑Q1 in the VSON (DMT) package, and I would like to confirm the electrical connection of the exposed thermal pad (TP).

In the datasheet, the thermal pad is shown in the mechanical drawing, but the pin description table does not list the pad as a GND pin or indicate any internal electrical connection. Because of this, it is unclear whether the thermal pad is:

  1. Internally connected to GND,
  2. Internally connected to another node, or
  3. Electrically floating inside the device and intended only for thermal dissipation and mechanical stability.

Any clarification would be greatly appreciated.

Thank you!

  • Hi Shota,

    1. Internally connected to GND.

    Please further note that table 4-1 lists the pad for a GND connection, as well as footnote 3 below the mechanical drawing and footnote 4 for more information, thanks.

    Best Regards,

    Michael.