ESD441: Regarding Component Tilting During Reflow

Part Number: ESD441

Hi team,

When the customer mounted the ESD441DPLR and ESD341DPLR on the PCB using a reflow process, component tilting was observed.
According to the datasheet, the implementation was performed using a metal mask thickness of 100 µm, a metal mask aperture size of 0.28 × 0.25 mm, and the recommended land pattern.
If there are any inaccuracies or issues with the above information, please kindly advise.
Best regards,
Kyohei