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TCAN2847-Q1: Question about thermal via of TCAN28473RHBRQ1

Chase Jeong
Mastermind 9500 points

Part Number: TCAN2847-Q1

Dear TI experts,

My customer have a question about thermal via of TCAN28473RHBRQ1.

In the page 226 of datasheet I can find land pattern example as below ;

image.png 

  1. Can I use vias which diameter is larger than 0.2mm? Because End customer's recommendation is larger than 0.3mm.
  2. Can I use more than 12 vias? what is maximum number of vias? is it unlimited?

I am asking it because I saw the description as below.

http://www.ti.com/lit/slua271

"For thermally challenging applications, TI recommends that the thermal vias be placed on a pitch of approximately 1,0 mm. Per standard PCB manufacturing capabilities, 0,3 mm diameter drill holes are recommended as a starting point, but a smaller via offers less risk of solder volume loss."

Please check this issue. Thanks.

Best regards,

Chase

  • 0
    TI__Genius 17176 points

    Hi Chase, 

    If the vias are exposed without any solder mask on top, that should be fine as long as your customer recognizes that making them too big or adding too many increases the risk of solder flowing through the vias and coming out the other side of the board, potentially shorting something. I can't give an exact number for when that will be an issue because it depends on the solder paste, board thickness, etc. You can get around this by plugging the vias on the back of the board, but that will increase your board cost and potentially lead to voiding due to trapped gas in the vias.

    If the vias are covered by a solder mask, then that takes away from the surface area that is in contact with the thermal pad of the IC package. That could cause the device to heat up more, especially if your customer is drawing a lot of power from the device. 

    Regards,

    Matt