TCAN1057A-Q1: Lead Frame Plating Specifications

Tsuyoshi Saito

Part Number: TCAN1057A-Q1

Product : TCAN1057AVDRQ1

I need the following information to register new electronic parts in my company.

1) Lead and electrode plating specifications (including thickness)

note: The composition ratio of plating should also be indicated. The thickness of plating should be Management width.

I would be happy if you could report the results in PDF file.

0 Michael Ikwuyum 28 days ago

Hi Tsuyoshi,

I would recommend requesting PPAP with your local TI representative to help share with you, thanks.

Best Regards,

Michael.

0 Tsuyoshi Saito 28 days ago in reply to Michael Ikwuyum

Hi Michael,

Thank you for your reply. However, I am confused.

I consulted with the sales representative of Japan TI about PPAP, but I was instructed to request through TI.com.

What should I do? Requests like this have been made many times in the past, with over 100 records on TI.com.

Regards,

T.Saito

+1 Michael Ikwuyum 27 days ago in reply to Tsuyoshi Saito

Hi Tsuyoshi,

Yes,

I believe the pdf should download the ppap with the needed information as needed, thanks.

Best Regards,

Michael.

0 Tsuyoshi Saito 24 days ago in reply to Michael Ikwuyum

Hi Michael,

I was able to download the PPAP documents.

My inquiry has been resolved. Thank you for your cooperation.

Regards,

T.Saito

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