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TLK2711-SP: Questions on packing configuration and assembly site quality data

ishii-ko
Prodigy 230 points

Part Number: TLK2711-SP

Regarding TLK2711-SP, we have the following questions.

1. Packing configuration 

Could you please advise on the packing configuration?

If available, we would appreciate it if you could share the tray drawing and information on the vacuum (dry) packing condition. 

2. Assembly site (EXT-MFG) description

In the assembly site information, "EXT-MFG" is noted, along with the remark: "Quality data will change based on assembly site." Could you please clarify which quality data items may vary depending on the assembly site? Also, are there any documents or data available that show these differences? 

  • +1
    TI__Guru**** 163921 points

    Hi Ishii:

      I will check with PE for above two questions and give you update soon.

    Bets

    Brian

  • +1 in reply to Brian Zhou
    TI__Guru**** 163921 points

    Hi Ishii::

      This is information for tray drawing.

    https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/4217905.DWG

     

    For the second question the device is assembled at MTT (Subcon- Microchip Tech AT). Final Test is done in TI PHI (TI Philippines). Since this is space part if anything changes in the factory flow a re-qualification of the package would need to be performed. Nothing specific to note since it would depend on what changes.

    Best

    Brian

  • +1 in reply to Brian Zhou
    Prodigy 230 points

    Hi Brian,
    Thank you very much for your prompt response and for sharing the tray drawing.
    I also appreciate your explanation regarding the assembly and test flow, and I understand the process.
    Best regards, 
    Koji