SN75ALS193: SN75ALS193DR – Verification of Package Construction Differences and PCN Impact

Hi Suwitcha,

Devices with top marking 38AFK6M show that the device is from sherman fab which would be legacy/pre-PCN material. This one also uses the OI process called out in the PCN.

Top marking 32A1FNM is also from sherman and is considered to be legacy/ore-PCN material. This one uses the OI process which is called out in the PCN.

So from my internal look up system, it seems to show both are likely the same die but we've used different leadframe and packaging for both. I also wasn't able to find a PCN that called out a different leadframe/packaging for this device. I'm not verifying that both of these devices are authentic TI devices but based on the top markings it would indicate that the die comes from the same fab site if authentic. 

So the differences you see don't appear to be because of the PCN. New material is fabbed in RFAB which neither of these devices are from. 

-Bobby

EDIT:
Those dies are also being discontinued based on the PCN. So for newer systems, I would recommend the customer to try to reach out to TI to get new post PCN samples to test/validate in their system. 

Hello Bobby,

The failed unit (DC2334) was purchased from Mouser, and the reference sample (DC2305) was purchased from DigiKey. Both distributors are authorized TI distributors.

Given that:

1. The observed leadframe and package constructions are different
2. You were unable to find a PCN covering the leadframe/package differences
3. Both parts were sourced through authorized TI distribution channels

Would TI consider these differences to be normal manufacturing variation for SN75ALS193DR?

Also, is it possible for leadframe or package construction changes to occur without a customer-facing PCN, provided there is no impact to form, fit, function, quality, or reliability?

Any additional guidance would be greatly appreciated.

Suwitcha,

Thanks

Hi Suwitcha,

Suwitcha Naoniwes said:

Also, is it possible for leadframe or package construction changes to occur without a customer-facing PCN, provided there is no impact to form, fit, function, quality, or reliability?

My understanding is that the assembly site can change the package construction at their own discretion.

As for leadframe. I'm not 100% sure but it can be possible for a device to have different assembly sites that use different leadframes though this one seems to indicate a single assembly site. I don't know if leadframe changes require a PCN for commercial grade devices (my guess is it would be optional). For automotive grade (or higher) though, it would require a PCN. 

-Bobby

Hi Bobby,

Could you please let me know if there is any TI documentation or reference that states different leadframe/package constructions may be used for devices from the same assembly site without a customer-facing PCN?

If there is no formal document available, could you please confirm whether this is TI’s standard manufacturing practice for commercial-grade devices?

Thanks,

Suwitcha

Suwitcha,

I recommend you reach out to this email: PCN_ww_admin_team@list.ti.com for questions about PCNs. They would be more knowledgeable than me about the subject.

-Bobby