SN65DP159: SN65DP159 Ground Pad Layout for Thermal Dissipation

Erika Long

Part Number: SN65DP159

Hi Team,

My customer is using SN65DP159RGZR and wanted to understand if there are differences in thermal performance / heat dissipation. Their footprint looks like has the GND vias and doesn’t have a copper pour but the datasheet footprint shows a full pour.

They are running into heat dissipation issues and am curious if adding a copper pour instead of the vias would help. My assumption is the full pad will assist in improved thermal gradient so would be more beneficial for heat dissipation. Let me know your thoughts!

Best,

Erika

Layout File Footprint:

5 days ago

0 David (ASIC) Liu 5 days ago

TI__Guru**** 188951 points

Hi,

I would point them to this app note, https://www.ti.com/lit/an/slua271c/slua271c.pdf. This particular QFN package is thermally and electrically efficient due to the exposed die attach pad on the under side of the package. And this exposed pad must be soldered to the PCB board ground with at least 75% solder coverage to enhance the device's thermal and electrical characteristics\.

Thanks

David

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SN65DP159: SN65DP159 Ground Pad Layout for Thermal Dissipation