Part Number: LMH1297
I'm currently designing a board using the LMH1297RTV for a 12G-SDI application and would like to request a SCH and LYT review of my implementation before releasing the design for fab. I've followed the reference material but would like someone to verify the layout for signal integrity and overall performance at 12G.
One area in particular I want feedback on is the impact of using a through hole BNC connector which introduces a stub on the SDI signal.
I'm happy to provide the schematic, PCB layout, stackup, or any other design files that would be helpful.
Thanks,
Mike Heffer
