SN65C1168E: SN65C1168EPWR Thermal Resistance

Trevas Chen

Part Number: SN65C1168E

What is the thermal resistance of junction to case bottom for SN65C1168EPWR? It has a TSSOP which is listed as N/A on the datasheet.

0 Ethan White 14 days ago

Hi Trevas,

That measurement only applies for packages with an exposed thermal pad, so there is no value for TSSOP.

-Ethan White

0 Trevas Chen 14 days ago in reply to Ethan White

Hi Ehtan,

Is there a junction to lead thermal resistance that you can provide instead?

Thanks,
Trevas

0 Ethan White 14 days ago in reply to Trevas Chen

Unfortunately the only thermal parameters I have are the ones in the datasheet.

-Ethan White

0 Trevas Chen 13 days ago in reply to Ethan White

Do you know if there is a way to request for TI to measure this data?

Thanks,
Trevas

+1 Ethan White 13 days ago in reply to Trevas Chen

Hi Trevas,

I misread your request earlier. Junction to lead is more or less the same as junction to board. You should just be able to use that.

-Ethan White

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