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TCAN1043A-Q1: TCAN1043ADMTRQ1

Thomas Regan
Prodigy 110 points

Part Number: TCAN1043A-Q1

Hi Team,

To support our qualification review, we would appreciate your assistance in providing the AEC-Q100 E12 (Lead-Free) test report for the part TCAN1043ADMTRQ1 (28758403)

Please ensure the report captures the results for these key tests:

  • Solderability Test
  • Resistance to Solder Heat Test
  • Moisture Sensitivity Test
  • Tin Whisker Acceptance Test

 

Thanks!

  • 0
    TI__Guru* 80772 points

    Hi Thomas,

    A standalone AEC-Q100 E12 (Lead-Free) test report for TCAN1043ADMTRQ1 was not found as part of the available documentation. Further note that the device's qualification data is published in TI's Quality & Reliability record, which covers one of your four requested tests (solderability) plus lead-free material and MSL data — but does not include separate entries for Resistance to Solder Heat or Tin Whisker Acceptance.

    What is available today

    Requested test Status in TI records
    Solderability Pass — C3, JEDEC J-STD-002, requirement >95% lead coverage 1
    Moisture Sensitivity Rating published as Level-2-260C-1 YEAR 1 — rating only, no test report
    Resistance to Solder Heat Not listed 1
    Tin Whisker Acceptance Not listed 1

    Supporting lead-free / package data:
    - Lead finish / ball material: NiPdAu (NIPDAU) 1
    - Package: 14-pin VSON (DMT), active production, RoHS: Yes 2
    - Device is AEC-Q100 qualified for automotive applications 3

    Other AEC-Q100 results reported as Pass: biased HAST (A2), unbiased HAST (A3), temperature cycling (A4), high-temperature storage bake (A6), HTOL (B1), early-life failure rate, wire-bond shear/pull, physical dimensions, solder-ball shear, and electrical reliability tests 1.

    Hence, I would recommend to download the live Quality & Reliability report for the orderable at the link below, generated on demand and is the authoritative source for this part's qualification summary: www.ti.com/.../report

    For the items not covered there (Resistance to Solder Heat, a formal MSL test report, and Tin Whisker Acceptance per JESD201), these are typically handled as package-family-level documentation rather than per-orderable reports. Request them directly from your TI field / regional representative or quality contact, specifying the DMT / VSON package family and NiPdAu finish, thanks.

    1. TI Quality, Reliability & Packaging Report — TCAN1043ADMTRQ1
    2. TCAN1043A-Q1 Datasheet (SLLSFD1F), p. 44
    3. TCAN1043A-Q1 Datasheet (SLLSFD1F), p. 1

    Best Regards,

    Michael.