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TCAN4551-Q1: Implementation-Related Documentation

Yuta Nishie
Mastermind 6145 points

Part Number: TCAN4551-Q1

Hi,

Could you please provide any implementation-related documentation for the TCAN4551RGYRQ1, such as the recommended land pattern, PCB footprint dimensions, and solder reflow guidelines?

I reviewed the datasheet, but I was unable to find information regarding the recommended land pattern or pad dimensions.

If there are any application notes, package-related documents, or assembly guidelines available, I would appreciate it if you could share them.

Best Regards,

Nishie

  • +1
    TI__Mastermind 38271 points

    Hi  Nishie,

    The package mechanical drawing information is automatically appended to the datasheet from our packaging database and I'm not sure why it is missing at the moment.  

    You can find the package drawing information that was included in a previous version of the datasheet at this (Link).

    Regards,

    Jonathan