TXE8116-Q1: Thermal pad connection, MSL, reflow profile

Shinji Tsuji

Genius 15784 points

Part Number: TXE8116-Q1

Hi team,

Could you please support the request below?

#1. Regarding to VQFN package. Does exposed thermal pad internally connected to GND or NC?

#2. MSL level

#3. Reflow profile

regards,

0 Joshua Salinas 6 days ago

Hello Shinji,

1) The thermal pad is not internally connected to the die. For improved thermal performance you can connect the pad to GND or leave it floating.

2) For MSL it's Level 1

3) For Reflow it's 260C

Regards,

Josh

0 Shinji Tsuji 5 days ago in reply to Joshua Salinas

Hi Josh-san,

The recommended operating range, Ta is specified as maximum 130c while this

device is rated for Grade 1 (Ta up to +125c)

Which temp range does datasheet EE parameter guarantee?

regards,

0 Joshua Salinas 5 days ago in reply to Shinji Tsuji

Hello Shinji,

We guarantee up to 125C. It seems there is a typo on the ambient temperature parameter but this will be corrected when the part fully releases.

Regards,

Josh

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