Dear support,
I have a question about chip TL16C752C in QFN32 package.
In the datasheet I haven't found if its thermal pad has to be connected to GND or must be left electrically isolated from other nets (only for dissipation): For me it's bettere the first solution because I have GND plane. Viceversa, If it must be isolated, I have to povide a plane big enought to dissipate but isolated from the rest of circuits.
Please let me know.
Thanks very much, Daniele.