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TL16C752C in QFN32 package

Other Parts Discussed in Thread: TL16C752C

Dear support,

I have a question about chip TL16C752C in QFN32 package.

In the datasheet I haven't found if its thermal pad has to be connected to GND or must be left electrically isolated from other nets (only for dissipation): For me it's bettere the first solution because I have GND plane. Viceversa, If it must be isolated, I have to povide a plane big enought to dissipate but isolated from the rest of circuits.
Please let me know.

Thanks very much, Daniele.