Hello E2E Community!
I have a question re: how to interpret TI's technical /policy statement (#15) on the Lead (Pb)-Free FAQs site "Eco-Info & Lead-free (Pb-free):" http://focus.ti.com/quality/docs/gencontent.tsp?templateId=5909&navigationId=11749&contentId=5045
I'm trying to determine if the Pb-Free (NOPB) version of specific TI parts in my design are "backward process compatible" with the Pb-based version of the device. Specifically, I'm using the DS34LV86TM and DS34LV87TM, and I want to determine if the "NOPB" versions of those devices are compatible with Pb-based processing. I believe they are, but it's not very clear from reading the FAQ website.
TI's Pb-Free FAQ's #15 states: "Most TI leadframe based packages utilize Nickel-Palladium-Gold (NiPdAu) finishes and Green mold compounds. This finish & mold compound is fully compatible with current Pb-based solders and reflow temperatures, and newer lead-free solders with their higher reflow temperatures. A limited number of products may initially only be available with a matte-Tin (Sn) finish, which is also compatible with Pb-based soldering processes.
The leadframes for the 16SOIC package of the DS34LV86TMNOPB and DS34LV87TMNOPB appear to be 96% Cu, and not NiPdAu; can I assume that these NOPB parts are actually backward process compatible with the current Pb-based versions of these parts?
Thanks very much for the feedback/guidance!
Sincerely,
Jim Sobe, Sr. Components Engr, UTC Aeropsace Systems