Hello,
Our contract manufacturer is having trouble assembling the TUSB7340 correctly. When assembled correctly, the part works great, so I'm confident we aren't damaging the parts.
We've had the assembled boards x-rayed and it looks like some of the part's contact pads in the inner row are not making connection to the board's pads. The outer row contacts seem to be fine, it's just the inner row we're having trouble with. We've tried to follow TI's recommended layout footprint and guidelines, so I'm wondering if there are any other suggestions that would help us get this working reliably.
On our lasted set of boards we tried a slightly thicker solder mask and almost none of them work. I'm thinking that the thicker solder mask is keeping the part lifted off the board and preventing it from making contact with the boards pads. I would like to confirm whether this might be true and if there's a way of specifying how the boards should be made to prevent this problem.
Thanks for your help
