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Need Information- AM26C32QDG4

Jayakumara krishnasetty
Expert 2440 points

Hi Can you please provide the following information for the AM26C32QDG4 Part ?

1. Junction Temperature Max (Tj Max)

 2. Typical Power dissipation (Pd typ)

3. Maximum Power dissipation (Pd max)

4. Thermal Resistance Junction to Ambient (Theta JA

5. Thermal Resistance Junction to Board (Theta JB)

6. Thermal Resistance Junction to Case (Theta JC)

7. Weight

 

AM26C32QDG4

  • 0
    TI__Genius 14070 points

    Hello Jayakumara,

    Apologies for the delay in response as we had a national holiday this past Monday and a lot of people were out of office around that time.

    The apps engineers in the interface forum could help better support this question, and I will move this question over to the forum.

    Thanks and Best Regards,

    Wen-Shin Wang

  • 0 in reply to Wen-Shin Wang
    TI__Expert 3695 points

    Dear Jayakumara,

    please find my comments below.

    1. Junction Temperature Max (Tj Max) = 150C

     2. Typical Power dissipation (Pd typ) = Depending on the load. The Output voltage drop at a ceratin load current would allow you to estimate the power dissipation in the output driver

    3. Maximum Power dissipation (Pd max) = See 2.

    For 4-7, i need to get back to you.

    Thansk, Tobias

  • 0 in reply to Tobias Nass
    TI__Expert 3695 points

    Jarakumara,

    the device mass = 157.1mg.

    The thermal impedance is similat to any other 14pin D type package.

    Thansk, Tobias