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questions related to the TLK2711A and TLK2711-SP

Other Parts Discussed in Thread: TLK2711-SP

I apologize but the only way I can post my question regarding the TLK2711 (both A and -SP parts) is by posting it as a reply to someone else's question because I do not have a 'New Post' button on the forum webpage in my browser.

 

I will post this message without the question, make sure it reaches the forum and then reply to my own message with my question.

 

Tony

  • So, my 'reply' method seems to have got my message posted. Here are my questions related to the TLK2711A and TLK2711-SP: -

     

    The -SP part uses a much larger 'HFG' package than the 'RCP' package used by the A part. Inside each package, though, do the two parts use the same die or, at least, the same size die?

     

    I know the -SP part has the extra 4 (GND) pins and the A part has both GND and GNDA pins, suggesting the die in each part is different but that may not be the case.

     

    If the die is the same in both parts - or, at least, the size of the die is the same in both parts - the larger package for the -SP part suggests the package RLC parasitic elements will be larger for the -SP part. Is that the case?

     

    The datasheet for the A part and the datasheet for the -SP part have a application information that shows the VDDA supply should include a '5 Ohm at 100MHz' inductor but there are no justification or explanation details for this impedance profile for the inductor. That is, there is a circuit diagram showing the inductor and decoupling capacitors but no supporting notes. Why '5 Ohm at 100MHz'? What if a different (e.g. higher impedance) inductor was used? What would be the effect?

     

    Thank you!

    Tony