TPD4S014EVM Gerbers

Luis Filipe Rossi1

Other Parts Discussed in Thread: TPD4S014EVM, TPD4S014

Hello, I was looking at TI and could not find TPD4S014EVM Gerbers. Are they available? I am using the TPD4S014 at my design and would like to check if i can find any good layout practice at the TI EVM.

Best regards,

Luis

over 11 years ago

0 Scott Cummins over 11 years ago

TI__Mastermind 31655 points

Hello Luis,

The TPD4S014 evaluation module is currently undergoing revisions. Please allow up to 6 weeks for the new EVM and files to become available.

Regards,

0 Luis Filipe Rossi1 over 11 years ago in reply to Scott Cummins

Prodigy 250 points

Hello Scott,

Thank you for you reply.

Can't you send me the old files?

Regards,

Luis

0 Scott Cummins over 11 years ago in reply to Luis Filipe Rossi1

TI__Mastermind 31655 points

1263.tidap-19912-02ACD.zip

Hello Luis,

I've attached the gerber files for the previous EVM. However, this might not be the best reference since it had some issues that required the revisions I mentioned. I believe there were problems with the USB connector and inconsistent grounds.

Are you having any problems with your current layout that we could assist you with?

Regards,

0 Luis Filipe Rossi1 over 11 years ago in reply to Scott Cummins

Prodigy 250 points

Thank you Scott, No, my design is working ok (it is very compact and for 12Mbps USB so much easier). I was wondering if it is a good practice to tie the PIN 8 to the thermal pad or connect to the GND plane through a different via. Also, I noticed that the pads are much larger than the IC body. My assembly house asked me to reduce the pads. Should I keep the long ones or there is no problem on reducing it? Thank you, Best regards, Luis

0 Guy Yater over 11 years ago in reply to Luis Filipe Rossi1

TI__Genius 12190 points

Luis,

Yes, Its good practice to connect the thermal pad to Pin 8. I also recommend the thermal pad be tied to the ground plane using in pad VIAs. This requires filling the VIAs for soldering. If this it is not feasible place some VIAs to the ground plane adjacent to the thermal pad, both above and below, as shown here:

Reducing the pad size should not be a problem as long as they exceed the pin size by an amount acceptable to the process rules for manufacturing the PCB.

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TPD4S014EVM Gerbers