Hi team,
My customer is considering TMDS442 for adoption.
He designs peripheral circuit of the device and concirned if it is necessary to separate each GND of DDC/CEC(17pin), TMDS Data Shield(2,5,8,11pin), FG(outer periphery of connector and chassis).
Is there any recommendation of GND separation with TMDS442?
This isn't pure question of the device(TMDS42), so I think it may be difficult to answer...but I'm glad if you give me a comment.
I also heard that there is competitive device that GND separation is recommended.
Best Regards,
Yaita / Japan disty