Hi,
I can not understand the phenomenon of failure I, the analysis result content of TI.
According to TI result, the failure by Electrical Overstress (EOS) damage in the ESD of pin13(OUT_D4+).
I wants to know the relation between failure phenomenon and EOS damage in the ESD of pin13(OUT_D4+).
- My problem description: Output is not carried out for the signal of OUT_D1+/OUT_D1-(22,23pin), OUT_D2+/OUT_D2-(19,20pin), and an image is not displayed.
- Failure Analysis results by TI : The failure of caused by EOS damage in the ESD of pin13(Out_D4+)
- My question : How do you regard the causation of problem pin#(22,23 and 19,20) and EOS damage pin13(OUT_D4+)?
Best regards