1. Is the center PowerPAD supposed to connect to ground?
2. If yes, which ground (DGND, PGND, TGND)?
3. Is the 5mm x 5mm square area large enough, or is the 8mm x 8mm square area required? There is a note on page 30 that says “via pattern and copper area under solder mask may vary depending on layout constraints”. There is also a paragraph on page 24 that says “For thermal considerations, soldering the back side of the TFP410 to the application board is not required, as the device power dissipation is well within the package capability when not soldered”. There is another paragraph on page 24 that says the thermal pad should be 5.9mm minimum, even though the example board layout info on page 30 shows the pad a 5.0mm. Which is correct?
Thanks, Dean
