I'm looking for the maximum junction temperatures and junction-to-case thermal resistances for the following components. Any and all help would be greatly appreciated.
5962-9762101QFA
5962-9762201QFA
SN65LVDS31D
DS26LV32AQML
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I'm looking for the maximum junction temperatures and junction-to-case thermal resistances for the following components. Any and all help would be greatly appreciated.
5962-9762101QFA
5962-9762201QFA
SN65LVDS31D
DS26LV32AQML
Hi Jared,
This will take a bit of time because we will need to put in a request from our thermal modeling team. I will get back in a week's time to see what we can do.
Thanks,
Michael
Hi Jared,
So far, the only data I am able to retrieve are the thermals for the SN65LVDS31D. See below:
Theta_JA | 84.8 |
Theta_JC (top) | 46 |
Theta_JB | 41.8 |
Psi_JT | 11.1 |
Psi_JB | 41.5 |
Theta_JC (bottom) | n/a |
Hope this helps!
Michael
Hi Jared,
I have recently attained data for the DS26LV32A, in C/W.
Theta_JA | 109.5 (for reference only) |
Theta_JC (top) | N/A |
Theta_JB | 97.5 (for reference only) |
Psi_JT | 28.2 |
Psi_JB | N/A |
Theta_JC (bottom) | 6.2 |
From our packaging team:
"The DS26LV32A is sold as an unformed part, so actual Theta_JA, Theta_JB depends on lead form. Usually this part type will be used with package underfill and/or conformal cost which JESD 51 does not encompass as well, so these values are for reference only".
So far, the request for the remaining parts in your original post have not been closed, and I do not have an estimate about their completion date.
I hope that the thermals we have been able to provide will serve as a good guideline about typical thermal values to expect.
Thanks,
Michael