About PCA9515ADRGR

Madhura Shetty

Hi,

We are using PCA9515ADRGR in our project and there is one thermal pad in that IC. Nothing is given in datasheet as how should it be connected?.

In my design I have connected it to GND. Will the deign work?

Regards

Madhura

over 10 years ago

0 Jonathan Valdez over 10 years ago

TI__Genius 16560 points

Hello Madhura,

You are correct in assuming that the proper connection for the thermal pad is to ground. Typically, we would recommend you put as big a piece of trace/metal under the thermal pad as you can (about the size of the pad or more) and connect it to the ground plane with several VIAs, as this will provide the highest thermal performance.

0 Madhura Shetty over 10 years ago in reply to Jonathan Valdez

Intellectual 810 points

Thanks Jonathan.. :-)

0 steve best over 10 years ago in reply to Jonathan Valdez

Prodigy 10 points

I had the same question. Can you kindly add this to the data sheet (please). Thanks

0 Jonathan Valdez over 10 years ago in reply to steve best

TI__Genius 16560 points

Thanks for the feedback, Steve.

I've taken the note to update the datasheet to add this data.

You can also find this information and other layout guidelines in our QFN Layout Guideline Application report: www.ti.com/.../sloa122.pdf

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About PCA9515ADRGR