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DS99R105_106 / About Evaluation Board.

Sho Ogane
Genius 5575 points
Other Parts Discussed in Thread: LV24EVK01, DS92LV2412, DS92LV2411

Hi all.

My customer would like  to evaluate DS99R105/106.
There is the user manual (SERDES05-40USB) on the TI web site, but we can't request the EVM board.
Could you tell me how to get the EVM board?
If you can't give me it, please tell me the closest family EVM that I can get.

Best Regards,
Sho Ogane

  • 0
    TI__Mastermind 29655 points
    Hi Sho,

    This board has been obsoleted by TI and is no longer made. However, I think some distributors may still have stock for these eval boards. I checked on Digikey, and it appears that you can still order the SERDES05-40USB EVM.

    If this is not possible, I recommend moving to a slightly different family of parts that are also FPD-LINK II/Channel Link II, but uses CML instead of LVDS for serialization topology. Try looking at the DS92LV2411/DS92LV2412 (LV24EVK01):

    www.ti.com/.../lv24evk01;tisearch=Search-EN-Everything

    Thanks,

    Michael
  • 0 in reply to Michael Lu (Santa Clara)
    Genius 5575 points

    Hi Micheal.

    Thank you for the reply.
    I recommended DS92LV2411/DS92LV2412(LV24EVK01) to my customer.

    I have 2 requests about DS99R105/106.

    1.My customer would like to simulate,please give me Ibis AMI.
    2.My customer can't get EVM(SERDES05-40USB).
       Please give me the data of the DS99R105 to use the PreEmphasis feature will extend the transmission distance in the data, because he would like to judge 
       whether to use or not.

    Best Regards,
    Sho Ogane
     

  • 0 in reply to Sho Ogane
    TI__Mastermind 29655 points
    Hi Ogane-san,

    Unfortunately, we do not have an IBIS or IBIS-AMI model for these parts. However, I recently was able to find one SERDES05-40USB EVM in our office that I can send over. I am currently coordinating with TI Japan to ship this EVM to you as soon as possible so that your customer can observe the Pre-Emphasis feature directly instead of just through simulation.

    Thanks,

    Michael
  • 0 in reply to Michael Lu (Santa Clara)
    Genius 5575 points

    Hi Micheal san.

    Thank you for looking for the EVM!
    My customer is pleased with your support.

    I am waiting the EVM.
    I would like to appreciate for your help.

    Best Regards,
    Sho Ogane

  • 0 in reply to Sho Ogane
    Genius 5575 points

    Hi Micheal san.

    My customer has the two questions about the thermal pad.

    1.Please tell me how to design the thermal via.

    2.Which GND pin should I connect to thermal PAD?

    Best Regards,
    Sho Ogane

  • 0 in reply to Sho Ogane
    TI__Mastermind 29655 points

    Hi Ogane-san,

    1. For information about designing the thermal pad for this package, please refer to SNOA401. Page 19 should be useful to explain soldering for the thermal pad. Typically solder is placed with a solder stencil in the middle of each square aperture section of the thermal pad, and a thermal via is placed on the intersections of the apertures.This helps improve board assembly yields.

    2. You can connect all the VSS GND pins to the thermal pad with a through via.

    Thanks,

    Michael

  • 0 in reply to Michael Lu (Santa Clara)
    Genius 5575 points

    Hi Micheal san

    Thank you for your reply.

    DS99R105 is 48WQFN(SQ48 ), but this device is not described in the SNOA401.
    Please give me the following thermal via information.

    If you don't have the information, please tell me the number of via, thermal via pitch and via size.
    I would like to receive your advise as soon as possible.

    Best Regards,
    Sho Ogane

  • 0 in reply to Sho Ogane
    TI__Mastermind 29655 points

    Hi Ogane-san,

    I looked closer at the DS99R105 and noticed that, assuming you are using the WQFN48 package and not the QFP package, the SNOA401 document should still be relevant. On the mechanical drawing at the end of the DS99R105 datasheet, there is a notice indicating that the item is SQA48D:

    Referencing the SNOA401 document, on p.6, this drawing matches the No PullBack (QUAD) for 48 pins, identical to SQA48A. Therefore, you can see stencil information in the following table. It looks like the ideal number of DAP aperture openings for thermal vias is 16.

    Recommendations for thermal via diameter and pitch for a typical No-Pullback package on PCB is provided on p. 10.

    Thanks,

    Michael

  • 0 in reply to Michael Lu (Santa Clara)
    Genius 5575 points

    Hi Micheal san.

    Thank you for a lot of advice for me. 

    I recommend this device to my customer, but my customer have negative point about the quiescent current.
    This device's quiescent current is 100mA. My customer is considering TI device or BU17101AKV-M/BU17102AKV-M(Rohm)
    Rohm device's quiescent current is lower than TI device.
    I think my customer will chose Rohm device, so if you know how to reduce quiescent current,please tell me  it.
    The value that my customer expects is about 50mA.

    Best Regards, 
    Sho Ogane



     

  • 0 in reply to Sho Ogane
    TI__Mastermind 29655 points

    Hi Ogane-san,

    Thanks for the feedback. How is your customer determining the quiescent current? From the datasheet, I am seeing that the current should be somewhere around 10-20 uA, not 100 mA. It is possible that I may be misunderstanding what the customer is trying to do.

    It is possible to minimize the quiescent current to 0 A from a systems standpoint by removing connection from the power supply regulator to the VIN pin of the DS99R105, DS99R106. 

    Thanks,

    Michael

  • 0 in reply to Michael Lu (Santa Clara)
    Genius 5575 points

    Hi Micheal san

    Thank you for the reply.
    Sorry, my customer has negative point about Tx and Rx total supply current.

    I think this value is important.



    Please give me your advise.

    Best Regards,
    Sho Ogane