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TPD12S520 RMN Package Suggested Footprint

Other Parts Discussed in Thread: TPD12S520

The datasheet for the TPD12S520 HDMI ESD protection chip does not provide a mechanical drawing for the RMN (QFN package) option.

I was able to find mechanical information from previous threads but there is no information regarding recommended footprint. Would TI be able to provide a recommended footprint for this package ?

Unless we have a recommended vetted footprint it would be difficult to justify designing in the part for volume production.